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一、概述电真空器件金属另件间联结的方法很多,由于钎焊具有真空气密性,可焊接不同种类的金属和合金,甚至能把金属与陶瓷连接起来,能把小而薄的另件连接成大的、复杂的部件,能保证另件原有的光洁度和精密的尺寸,因此钎焊及陶瓷封接工艺成了电真空器件制造工艺中的一个基本工艺。一个大型的微波电子器件需有上百条钎焊焊缝,累积焊缝总长达几十米;由此可知,钎焊焊料是电真空器件不可缺少的基本结构材料之一,焊料是多种多样的,
First, an overview of the electrical vacuum devices connected to the metal parts of many ways, due to the vacuum brazing vacuum tightness, can weld different types of metals and alloys, and even metal and ceramic can be connected to the small and thin parts Connecting into large and complex parts, to ensure the original pieces of other parts of the original finish and precision dimensions, so brazing and ceramic sealing process has become a vacuum device manufacturing process of a basic process. A large microwave electronic devices need to have hundreds of brazing seam, the cumulative total length of weld dozens of meters; It can be seen that the brazing solder is an indispensable component of the vacuum structure of the basic materials, solder is varied of,