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一、前言锡焊即软钎焊,是将焊料升温熔化,依靠毛细吸力填充焊缝间隙并润湿母材表面,经冷却结晶并与母材表面金属形成新的合金层而连接的过程。钎焊历史虽悠久,发展却缓慢。随着现代工业特别是电子工业的崛起获得了迅速发展。在电讯、电器、电子仪表及机械制造、国防和航空工业等领域均占有重要地位。某些场合下,钎焊甚至还是唯一可用的连接法方。科学技术的飞速发展,对电子元件和整机装配的可靠性要求越来越高,相应对焊料的性能和质量要求也越来越高。近年来,新发展的热浸焊、波峰焊等自动和半自动“群焊”工艺,要求对成百上千个焊点的元件板在1～3秒内全部焊完,这对锡焊料的性能
I. Preface Soldering is soldering, which heats and melts the solder. It relies on the capillary suction to fill the weld gap and wet the base metal surface. After cooling and crystallizing, a new alloy layer is formed on the surface of the base metal to form a new alloy layer. Although brazing a long history of development is slow. With the rise of modern industry, especially the electronics industry has been rapid development. In telecommunications, electrical appliances, electronic instruments and machinery manufacturing, defense and aviation industry and other fields have an important position. In some cases, brazing is even the only connection method available. With the rapid development of science and technology, the reliability requirements of electronic components and complete machine assembly are getting higher and higher, and the corresponding performance and quality requirements of solders are also getting higher and higher. In recent years, the newly developed hot dip soldering, wave soldering and other automated and semi-automatic “group welding” process requires hundreds of components of the solder joint board in 1 to 3 seconds all the welding finished, which solder performance