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采用微波消解技术,将电子电气产品中铅锡合金焊料样品用氢氟酸、硝酸和过氧化氢加热溶解后,加入硼酸以便掩蔽过量的氟离子,用双向视电感耦合等离子体原子发射光谱仪同时测定铅、镉、铬和汞,方法的检出限为0.002 1~0.017 mg.L-1,方法的回收率和精密度分别为94.9%~101.0%和0.25%~3.40%。
Using microwave digestion technology, the samples of lead-tin alloy solder in electronic and electrical products were heated and dissolved with hydrofluoric acid, nitric acid and hydrogen peroxide. Then boric acid was added to mask the excess fluoride ion and simultaneously determined by bidirectional apparent inductively coupled plasma atomic emission spectrometer The detection limits of lead, cadmium, chromium and mercury were 0.002 1 ~ 0.017 mg.L-1. The recoveries and the precision of the method were 94.9% ~ 101.0% and 0.25% ~ 3.40%, respectively.