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本文介绍了一种适应于无铅焊料的电子电路基板,是在传统的环氧树脂和酚醛树脂类固化剂组合成的新型树脂中,加入能遏制树脂组成物热膨胀的无机填料而制成的。研发者研究了该基板中添加的无机填料的种类、形状、分类,包括填料的添加量、粒径大小、分散性等,获得了减少由于低树脂流动性及高钻孔加工磨损性所带来的不良影响,确保了这类基板材料的高耐热性和附着性,并且可实现与普通FR-4同等的除钻污性。上述开发产品与传统基板材料制成的电子线路基板相比,热分解温度降低了20℃,铜箔剥离强度提高了0.1kN/m,热膨胀率减少了6×10-6/℃,即使在温度循环试验中也具有优异的绝缘性和的导通可靠性。且除钻污性时也可用通用的工序进行加工。
In this paper, an electronic circuit substrate adapted to lead-free solder is introduced, which is made by adding a new type of resin, which is a combination of a conventional epoxy resin and a phenolic resin curing agent, with an inorganic filler that can restrain the thermal expansion of the resin composition. Researchers studied the type, shape and classification of inorganic fillers added to the substrate, including the amount of fillers, particle size, dispersibility and the like, and obtained the results of reducing the impact caused by the low resin flowability and the high drilling process wear , The high heat resistance and adhesion of such a substrate material are secured, and the same dedusting property as the ordinary FR-4 can be achieved. Compared with the electronic circuit board made of the traditional substrate material, the developed product has a lower thermal decomposition temperature of 20 DEG C, an improved copper foil peel strength of 0.1 kN / m and a coefficient of thermal expansion of 6 10-6 / DEG C, even at a temperature of In the cycle test also has excellent insulation and conduction reliability. In addition to drilling pollution can also be used when the general process of processing.