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目的:通过扫描电镜观察银汞合金-树脂黏结剂黏结充填的窝洞,评价银汞合金黏结修复体的黏结界面情况。方法:65颗健康离体牙,分为对照组(5颗),采用常规银汞合金充填法;实验组(60颗),分别使用3种树脂类黏结剂黏结充填。场发射扫描电镜观察黏结界面。结果:实验组银汞合金充填体和牙体的结合面能够被树脂类黏结剂封闭,黏结剂能够与牙釉质、牙本质和银汞合金形成黏结,并可以封闭牙本质小管。自固化黏结剂的黏结完整性优于光固化黏结剂。结论:银汞合金联合通用黏结体系可以封闭银汞合金充填体结合界面,减少继发龋的形成。
OBJECTIVE: To evaluate the bonding interface of amalgam bonded prosthesis by scanning electron microscopy (SEM) observation of the amalgam-resin adhesive bond-filled cavities. Methods: Sixty-five healthy teeth were randomly divided into control group (n = 5), normal silver-amalgam filling method and experimental group (n = 60). Field emission scanning electron microscope to observe the bonding interface. Results: The interface between the amalgam filling body and the tooth body of the experimental group can be closed by the resinous adhesive, the adhesive can form the bond with the enamel, the dentin and the amalgam, and can close the dentinal tubule. The self-curing adhesive has better bonding integrity than the light-curing adhesive. CONCLUSION: The combination of silver-amalgam and universal bond system can close the amalgam filling interface and reduce the formation of secondary caries.