论文部分内容阅读
研制的TLGA22钎料是一种不含银及不含镉等有毒元素的Cu-P-Si系新型钎料。钎料熔化温度为708～720℃,具有优良的钎焊工艺性能和对紫铜钎焊优良的自钎能力。而且,钎缝具有能承受强力旋压变形的特点。钎料抗拉强度达689N/mm~2,搭接接头剪切强度为215.4N/mm~2。它可代替银钎料用于钎焊铜及铜合金。本文还通过与磷含量相同的二元Cu-P合金性能的对比,探讨了该钎料中硅对钎料各方面性能的有益作用,并对其机理进行了分析。
Developed TLGA22 solder is a non-silver and cadmium and other toxic elements of Cu-P-Si series of new solder. Brazing material melting temperature of 708 ~ 720 ℃, with excellent brazing performance and excellent brazing ability of copper brazing. Moreover, the brazing seam has the ability to withstand strong spinning deformation. The tensile strength of solder reaches 689N / mm ~ 2, the shear strength of lap joint is 215.4N / mm ~ 2. It can replace silver solder for brazing copper and copper alloys. In this paper, the beneficial effects of silicon on the performance of the solder in various aspects of the solder were also discussed by comparison with the performance of the binary Cu-P alloy with the same phosphorus content. The mechanism was also analyzed.