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引入铜金属作为基体组元来替代传统钛电极单一钛基体,借助扫描电镜及能谱仪研究Ti-Cu复合基的界面形貌及界面处元素分布,通过分析电极的线性扫描伏安(LSV)曲线,对比研究其涂层电极与传统钛涂层电极的电化学性能差异.研究表明:利用真空热压扩散烧结法可制备界面冶金式结合的Ti-Cu复合基材料,其界面的扩散反应和变化形式为:Cu+2Ti→Cu Ti2,3Cu Ti2+5Cu→2Cu4Ti3,Cu Ti2+Cu4Ti3→5Cu Ti,Cu4Ti3+8Cu→3Cu4Ti,Ti-Cu复合基涂层电极与传统钛涂层电极相比,其析氯电位负移40~90 m V,电极电催化活性提高.
The interface morphology and interface distribution of Ti-Cu composite were studied by means of scanning electron microscopy and energy dispersive spectroscopy, and the linear sweep voltammetry (LSV) of the electrode was analyzed. Curve and comparatively study the difference of electrochemical performance between the coated electrode and the traditional titanium coated electrode.The results show that the interfacial diffusion reaction and the interface metallurgical bonding Ti-Cu composite can be prepared by the vacuum hot- The variation forms are: Cu + 2Ti → Cu Ti2,3Cu Ti2 + 5Cu → 2Cu4Ti3, Cu Ti2 + Cu4Ti3 → 5Cu Ti, Cu4Ti3 + 8Cu → 3Cu4Ti, Ti-Cu composite coated electrode Compared with the traditional titanium coated electrode, Negative shift of the chlorine potential of 40 ~ 90 m V, the electrode electrocatalytic activity increased.