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倒芯片封装载板的最新积层法技术动向フリツプチツプ实装基板におけるビルドアツプ配线板の最新技术动向 本文叙述了典型的倒芯片封装载板用的积层印制板结构例子,进一步介绍有关IC芯片发展对载板要求,将是节距更小和端子数更多。载板的设计是 0.15mm 节距,0.025mm/0.025mm的线
Latest Stacking Method of Inverted Chip Package Carrier Board Technology Trend New Technology Trend of Flooded Chip Board Carrier Board This article describes a typical example of a build-up printed circuit board for an inverted chip package carrier board, Development of carrier requirements will be smaller pitch and more terminals. The design of the carrier is a line of 0.15 mm pitch, 0.025 mm / 0.025 mm