【摘 要】
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Eleetroless Ni-Cu-P deposits were deposited on the Si substrate in a basic hypophosphite-type plating bath.The effects ofpH value and the metal source compositi
【机 构】
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Department of Materials Science and Engineering,Graduate School of Materials Science
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Eleetroless Ni-Cu-P deposits were deposited on the Si substrate in a basic hypophosphite-type plating bath.The effects ofpH value and the metal source composition, Ni and Cu, in the plating bath on the kinetics of the Ni-Cu-P deposition were studied.The electroless Ni-Cu-P deposits were characterized by a scanning electron microscope, a transmission electron microscope, an en-ergy dispersive X-ray spectroscope, and an X-ray diffractometer.The results showed that the pH value of the plating bath had no ob- vious effect on the morphology and composition of electroless Ni-Cu-P deposits.However, the composition of the metal source, Ni and Cu, in the plating bath had great effect on the kinetics of electroless Ni-Cu-P deposition.
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