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1引言近年来,由于技术变化以及设计创新,SoC实现和结构流程历经了多次演进。然而,由于芯片缺陷及其他工艺变化而导致的设计失败依然困扰着所加工器件的健壮性和功能,导致产量过低、成本过高。汽车和军用设备受到的影响最大,原因是验收PVT(工艺电压温度)的范围和器件规格要严格得多。即
1 Introduction In recent years, SoC implementations and fabrications have undergone many evolutions due to technological changes and design innovations. However, design failures due to chip defects and other process changes continue to plague the robustness and functionality of the fabricated devices, resulting in low yields and high costs. Automotive and military equipment are the most affected, due to acceptance of the PVT (process voltage temperature) range and device specifications to be much more stringent. which is