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前言目前国内在进行金属与陶瓷的封接、金属与金属的焊接时,还大量应用Ag-Cu焊料。例如银(72％)铜(28％)的共晶焊料,它的熔点约779℃,焊接温度在780℃以上,焊料的蒸发在瓷封件焊接过程中是很明显的。用一块瓷片做试验,一半用清洁的瓷片覆盖住,另一半需和金属封接,在真空炉中用Ag-Cu焊料封接,取出后,在瓷片表面可以看到未覆盖部分有明显的灰色蒸发物。装管后,在制管工艺过程及管子工作过程中,Ag-Cu焊料蒸发可能污染瓷件的问题很少引起人们的重视。例如
Preface Currently in the domestic metal and ceramic sealing, metal and metal welding, but also extensive use of Ag-Cu solder. Eutectic solder, such as silver (72%) copper (28%), has a melting point of about 779 ° C and a soldering temperature above 780 ° C. Solder evaporation is evident during the ceramic package soldering process. With a piece of ceramic test, half with a clean ceramic cover, the other half to be sealed with the metal, the vacuum furnace sealed with Ag-Cu solder, remove, you can see the uncovered portion of the surface of the tile can be seen Obvious gray evaporation. After the tube is installed, the problems that the Ag-Cu solder evaporates and may pollute the ceramic pieces seldom attract people's attention during the tube making process and the tube work. E.g