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本文主要研究AlGaN/GaN二极管制备工艺中Ohmic Contact金属和Schottky Contact金属电极的制备,主要讨论了金属电极材料的选取,退火温度和退火时间对接触电阻的影响,最后得出了Ohmic Contact的比接触电阻和TiN的淀积参数。
In this paper, we mainly study the preparation of Ohmic Contact and Schottky Contact metal electrodes in AlGaN / GaN diode fabrication process. The effects of metal electrode material selection, annealing temperature and annealing time on the contact resistance are mainly discussed. Finally, Resistance and TiN deposition parameters.