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分析了热固性塑料的流动行为特点和IC封装充填过程中料流对金丝的冲击状态。用CAE软件对流道的平衡进行分析模拟,优化浇注系统,为提高IC封装产品合格率寻找一种简便有效的途径。
The flow behavior of thermosetting plastics was analyzed and the impact of metal flow on the gold wire during IC packaging filling was analyzed. CAE software to analyze the balance of flow channels to optimize the casting system, to improve the yield of IC packaging products to find a simple and effective way.