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In a highly competitive and demanding microelectronics market,reliable non-destructive methods for quality control and failure analysis of electronic components are highly demanded.Any robust non-destructive method should be capable of dealing with the complexity of miniaturized assemblies such as chip-scale packages and 3D IC stacks.Scanning acoustic microscopy (SAM) is indeed one the best non-destructive tools for failure analysis purposes.It is also a useful technique for imaging the morphology,location and size distribution of defects in different microelectronics components.SAM can detect delaminations at sub-micron thicknesses.