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The pressurized blister test is a very convenient technique to measure the adhesion energy between the thin film and the substrate.In this paper, the interface adhesion energy considering the substrate effect for an elastic film/substrate system was studied by the blister test.A theory based on the elastic plate with elastically restrained edges was proposed to evaluate the interface adhesion energy between the thin film and substrate.The interface adhesion energy was much smaller than that obtained by neglecting the substrate effect for a steady state of crack growth, while the interface adhesion energy was much larger than that obtained by neglecting the substrate effect for an unsteady state of crack growth.The mixed-mode angle for bending deformation is obtained, and the ranges of the interface adhesion energy are obtained.