Picosecond laser machining of deep holes in silicon infiltrated silicon carbide ceramics

• 作 者: QingZhang[1]ChunhuiWang[1]YongshengLiu[1]LitongZhang[1]GuanghuaCheng[2]
• 机 构: Science and Technology on Thermostructure Composite Materials Laboratory,Northwestern Polytechnical
• 出 处: 第一届中国国际复合材料科技大会
• 发表日期: 2013年期

　　Silicon infiltrated silicon carbide (Si-SiC) ceramics,as a high hardness material,are difficult to machine,especially drilling micro-holes.In this study,interaction of intense picosecond laser pulses (1 ps at 1030 nm) with Si-SiC ceramics had been investigated.Variations of the diameters and depths of circular holes with the growth of the laser energy density were obtained.The results indicate that the increase of machining depth follows a nonlinear relation with the increasing of laser energy density,while the diameter has little change with that.Moreover,it is found that some debris and particles are deposited around and inside the holes and waviness is in the entrance and at walls of the holes after laser processing.