Deposition of adherent diamond film on copper substrate using Cu-diamond composite interlayer - 论文文献免费下载 - 皮皮文库

Deposition of adherent diamond film on copper substrate using Cu-diamond composite interlayer

来源 :2011年材料表面与界面国际大会 | 被引量 : 0次 | 上传用户：z178933143

【作者】

：

Qiu Wan-qi Zhong Xi-chun Yu Hong-ya Liu Zhong-wu Zeng De-cha

【机构】

：

School of Material Science and Engineering, South China University of Technology,Guangzhou 510640, P

【出处】

：

2011年材料表面与界面国际大会

【发表日期】

：

2011年9期

【关键词】

：

Diamond coatings Copper electroplating Adhesion Chemical vapor deposition

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