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Many high-power electronic devices such as high-power LED devices and aerial devices work intermittently.If some of the heat generated by the chips could be stored in the working time with the thermal storage medium and released to the ambient air in the non-working time then the heat dissipation load of the heat sinks packed in the high-power electronic devices could be diminished and a better thermal management effect could be achieved.Based on this idea this paper proposed a thermal storage substrate and investigated its thermal storage properties experimentally.