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A novel PCBM-based n-type material,[6,6]-phenyl-C61-butyric styryl dendron ester(PCBSD),functionalized with a dendron containing two styryl groups as thermal cross-linkers,has been rationally designed and easily synthesized.In situ cross-linking of PCBSD was carried out by heating at a low temperature of 160℃ for 30 min to generate a robust,adhesive,and solvent-resistant thin film.