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Hybrid Integration of Novel Two Dimensional Materials with Silicon Photonics

来源 :The 9th International Workshop on Innovation and Commerciali | 被引量 : 0次 | 上传用户：pc167

【作者】

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【机构】

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ElectronicEngineeringDepartment,theChineseUniversityofHongKong

【出处】

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The 9th International Workshop on Innovation and Commerciali

【发表日期】

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2015年8期

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