Rapid Heating Micro-Embossing and Injection Molding Using Molds with Carbide-Bonded Graphene Coating

• 作 者: PengchengXie[1]L.JamesLee[2]EusebioDuarteCabrera[3]PanpanZhang[1]Ying-ChiehYen[1]PengHe[3]DanielGallego-Perez[4]LingqianChang[4]AllenYi[3]JoseCastro[3]
• 机 构: Department of Chemical and Biomolecular Engineering
• 出 处: 第十一届先进成型与材料加工技术国际研讨会
• 发表日期: 2014年期

　　Both hot embossing and injection molding are widely used for the fabrication of polymer products with very thin or micro scale features.However, the mold usually needs to be pre-heated to ensure complete filling and good replication of microscale features, particularly with high aspect ratios.Consequently, the long cycle time and incomplete filling have become major concerns in the industry.In this study, we present a novel carbide-bonded graphene coating on silicon molds/stampers to solve these problems.The graphene layer is highly electrically and thermally conductive, where a ~45 nm thick coating layer on silicon wafer surface could reach an electrical conductivity of 1.98×104 S/m.Direct current with a relatively low voltage could be applied on the graphene layer to achieve very fast local heating.