【摘 要】
:
有机半导体材料具有低的热导率,加之其低毒性和低成本等特点,使得其在热电材料领域具有潜在的应用价值。然而高性能的n-型共轭聚合物的种类还比较少,因此化学结构与热电性能的关系研究相对困难。
【机 构】
:
北京大学化学与分子工程学院,北京市海淀区成府路202号,100871 中国科学院化学研究所有机固体
【出 处】
:
2015年全国高分子学术论文报告会
论文部分内容阅读
有机半导体材料具有低的热导率,加之其低毒性和低成本等特点,使得其在热电材料领域具有潜在的应用价值。然而高性能的n-型共轭聚合物的种类还比较少,因此化学结构与热电性能的关系研究相对困难。
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