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真空条件下通过无压烧结法可以制得高纯度的Ti_2SnC粉体材料。利用XRD技术检测粉体材料的相组成,同时利用扫描电镜观察其微观结构。在烧结过程中,使用Ti粉、Sn粉和石墨粉作为原料粉,同时,主要考虑原料粉三者的配比、烧结温度和升温速率等因素对Ti_2SnC粉体材料的纯度的影响,进而采用不同的烧结方案制取Ti_2SnC粉体材料。结果表明,真空条件下Ti粉、Sn粉和石墨粉比例在2:0.9:0.85时以5℃/min的升温速率升到1270℃后保温制得的Ti_2SnC粉体材料纯度很高,而且在扫描电镜下观察到层状结构分布的Ti_2SnC。
High pressure Ti_2SnC powder can be obtained by pressureless sintering under vacuum. XRD techniques were used to detect the phase composition of the powder material, and the microstructure was observed by scanning electron microscopy. In the sintering process, the use of Ti powder, Sn powder and graphite powder as raw material powder, at the same time, mainly consider the raw material powder ratio, sintering temperature and heating rate and other factors on the purity of Ti_2SnC powder material, and then use different Preparation of Ti_2SnC powder material. The results show that the purity of Ti_2SnC powders prepared by soaking Ti powder, Sn powder and graphite powder at a ratio of 2: 0.9: 0.85 at 5 ℃ / min to 1270 ℃ under vacuum is high. The layered structure of Ti_2SnC was observed under electron microscope.