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5. Heterogenous integration technology using wafer-to-wafer transfer

Heterogenous integration technology using wafer-to-wafer transfer

来源 :2015两岸超声技术与医学研讨会 | 被引量 : 0次 | 上传用户：kukuhenku

【作 者】

：

Shuji Tanaka 

【机 构】

：

Department of Bioengineering and Robotics, Tohoku University, Sendai, Japan

【出 处】

：

2015两岸超声技术与医学研讨会

【发表日期】

：

2015年期

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