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Plasma Enhanced Atomic Layer Deposition of Copper Thin Film using [Cu(iPr-amd)]2 as Precursor
【机 构】
：
Laboratory of Plasma Physics and Materials,Beijing Institute of Graphic Communication,102600,Beijing
【出 处】
：
The 6th International Symposium on Plasma Nanosciences-Progr
【发表日期】
：
2015年3期
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