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半导体、玻璃都是脆硬材料。要切出高质量、符合工艺要求的片子,在具备高质量切片设备的前题下,还必须有高质量和高性能的刀片,并采取一系列的工艺措施。本文从刀片的结构出发,探讨了切片过程中刀片的安装、调整、修刀、检测以及张刀机构、切割过程、切削速度、冷却等确保高质量切割晶片的工艺方法。
Semiconductor, glass are brittle hard materials. To cut out high-quality, process-compliant films, high-quality and high-performance blades must be available and a range of process measures taken with the premise of high-quality slicing equipment. In this paper, starting from the structure of the blade, this paper discusses the process of blade installation, adjustment, repair, detection and knife mechanism, cutting process, cutting speed, cooling and so on to ensure high quality wafer cutting during slicing.