Develop of Al2O3/Cu substrate with high thermal conductivity

来源 :第二届中国国际复合材料科技大会 (CCCM-2) | 被引量 : 0次 | 上传用户：teer197841

【摘要】

：

　　The metal substrate has been widely used in common LED packaging filed due to their high thermal conductivity.However, because metal materials have a high t

【作者】

：

ZhangDan;WangShuangxi;WangWenjun;LiuGaoshan;

【机构】

：

College of Engineering,Shantou University,Guangdong,China

【出处】

：

第二届中国国际复合材料科技大会 (CCCM-2)

【发表日期】

：

2015年期

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　　The metal substrate has been widely used in common LED packaging filed due to their high thermal conductivity.However, because metal materials have a high thermal expansion coefficient which is unmatched with that of silicon chip, the ceramic substrate and ceramic-metal composite substrate were paid more attention recently in the field of high-powered LED.

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Develop of Al2O3/Cu substrate with high thermal conductivity

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