Etching Characteristic of Thermal Sprayed and Sintered Y2O3 Ceramic under the Fluorine-Based Plasmas

• 作 者: Yu-ChaoCAO[1]Jing-FengLI[1]KeWANG[1]hirokiYOKOTA[2]YoshiyasuITO[2]Bo-PingZHANG[3]
• 机 构: State Key Laboratory of New Ceramics and Fine Processing,School of Materials Science and Engineering
• 出 处: The 5th International Congress on Ceramics, ICC5(第五届国际陶瓷大会)
• 发表日期: 2014年期

　　In the field of semiconductor manufacturing industry,fluorocarbon plasma is widely utilized in the dry etching process.The fluorine-based plasmas will contact with the ceramic parts and then erode the processing chamber.Up to the present,Y2O3 is known as the best anti-plasma-erosion material,and has been used for the inner-wall coating and visible windows.