Laser-weldable Osprey CE11 alloy-AlSiC composites with bilayer structure for electronic packaging

来源 :第二届中国国际复合材料科技大会 (CCCM-2) | 被引量 : 0次 | 上传用户：lele

【摘要】

：

　　In this research, compression moulding and vacuum gas pressure infiltration technology were used to fabricate laser-weldable CE11 alloy-AlSiC composites wit

【作者】

：

GAOMingqi;

【出处】

：

第二届中国国际复合材料科技大会 (CCCM-2)

【发表日期】

：

2015年期

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　　In this research, compression moulding and vacuum gas pressure infiltration technology were used to fabricate laser-weldable CE11 alloy-AlSiC composites with bilayer structure.Microscopic observation revealed that the composites possessed a dense microstructure without gas pores and the interfacial region between CE11 alloy and AlSiC was uniform and continuous.

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Laser-weldable Osprey CE11 alloy-AlSiC composites with bilayer structure for electronic packaging

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