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In this paper, Chemical mechanical planarization (CMP) of Ge2Sb2Te5 (GST) is investigated using hard pad (IC1010) and soft pad (Politex Reg) in the acidic slurry, respectively.For the CMP with blank wafer, it is found that the removal rate (RR) of a-GST increases with an increase of pressure for both pads.However, the RR of GST polished using IC1010 is far more than that of Politex Reg.