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High reliability conductive adhesives were developed for interconnecting back contact solar modules employing a variety of back contact foils.In prior back contact foil designs immersion silver contacts (a noble metal resistant to corrosion and oxidation),plated onto copper back contact foils were used to ensure stable bonds and interconnect stability.Dielectric layers were used as a mask for the silver and to prevent shorting between the cells and the back contact foil.To reduce cost new foils without silver contacts have been introduced using copper and aluminum substrates with a variety of surface finishes.The conductive adhesive must form stable interconnection to these various interconnects through damp heat testing and thermal cycling.Stable electrical performance after 1000 hours at 850C/85%RH on non encapsulated back sheet foils from several suppliers has been demonstrated.In addition to contact stability the conductive adhesive needs to be extremely flexible to withstand thermal cycling,cure during the encapsulant lamination cycle without gelling before pressure is applied to the encapsulant,and have significantly lower cost than pure silver filled conductive adhesives