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Ultrasonic-assisted Soldering by Sn-Based Solder for Die Attachment in High Power Device Packaging
【机 构】
：
HarbinInstituteofTechnologyShenzhenGraduateSchool,China
【出 处】
：
2016顶尖和新兴材料科学家国际研讨会
【发表日期】
：
2016年7期
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